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General AI Systems and Interaction Design / Physical Device-to-Device Data Transfer

Users need complex setup or technical skills for data transfer in multi-device scenarios.

lightbulbPractical problemPhysical Device-to-Device Data Transfer

Users need complex setup or technical skills for data transfer in multi-device scenarios.

UIST '24DataPipettor: Touch-Based Information Transfer Interface Using Proximity Wireless Communication

Similar questions

lightbulbPractical problemPhysical Device-to-Device Data Transfer

Current haptic devices are bulky and require physical contact, making facial application difficult.

CHI '24Ultrasonic Mid-Air Haptics on the Face: Effects of Lateral Modulation Frequency and Amplitude on Users’ Responses

lightbulbPractical problemPhysical Device-to-Device Data Transfer

In PCB prototyping, soldering makes electronic component reuse difficult and generates e-waste.

CHI '24SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings

lightbulbPractical problemPhysical Device-to-Device Data Transfer

Smart grid communication networks struggle to handle diverse traffic demands, especially in encrypted traffic scenarios.

UbiComp '23Machine Learning-based Multi-Class Traffic Management for Smart Grid Communication Network

lightbulbPractical problemPhysical Device-to-Device Data Transfer

Delivery workers cannot accurately locate merchants in complex indoor environments, affecting delivery efficiency.

UbiComp '22P2-Loc: A Person-2-Person Indoor Localization System in On-Demand Delivery

lightbulbPractical problemPhysical Device-to-Device Data Transfer

Traditional screen communication is energy-intensive and highly susceptible to ambient light interference.

UbiComp '22SunBox: Screen-to-Camera Communication with Ambient Light

Related papers

Ultrasonic Mid-Air Haptics on the Face: Effects of Lateral Modulation Frequency and Amplitude on Users’ Responses

Ruiheng Lan, Xu Sun, Qingfeng Wang

SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings

Zeyu Yan, Jiasheng Li, Zining Zhang